JPH0574964B2 - - Google Patents

Info

Publication number
JPH0574964B2
JPH0574964B2 JP11341384A JP11341384A JPH0574964B2 JP H0574964 B2 JPH0574964 B2 JP H0574964B2 JP 11341384 A JP11341384 A JP 11341384A JP 11341384 A JP11341384 A JP 11341384A JP H0574964 B2 JPH0574964 B2 JP H0574964B2
Authority
JP
Japan
Prior art keywords
piezoelectric element
cylindrical body
conductive
rectangular piezoelectric
rectangular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP11341384A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60256210A (ja
Inventor
Tomokazu Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP11341384A priority Critical patent/JPS60256210A/ja
Publication of JPS60256210A publication Critical patent/JPS60256210A/ja
Publication of JPH0574964B2 publication Critical patent/JPH0574964B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP11341384A 1984-06-01 1984-06-01 チツプ形圧電共振子 Granted JPS60256210A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11341384A JPS60256210A (ja) 1984-06-01 1984-06-01 チツプ形圧電共振子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11341384A JPS60256210A (ja) 1984-06-01 1984-06-01 チツプ形圧電共振子

Publications (2)

Publication Number Publication Date
JPS60256210A JPS60256210A (ja) 1985-12-17
JPH0574964B2 true JPH0574964B2 (en]) 1993-10-19

Family

ID=14611632

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11341384A Granted JPS60256210A (ja) 1984-06-01 1984-06-01 チツプ形圧電共振子

Country Status (1)

Country Link
JP (1) JPS60256210A (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2689766B2 (ja) * 1991-05-22 1997-12-10 株式会社村田製作所 チップ型圧電共振子の製造方法

Also Published As

Publication number Publication date
JPS60256210A (ja) 1985-12-17

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